5055
High Speed SMT Board-to-Board Connectors 0.5mm Pitch, Mating Height 5mm
Go to configuration Note
Technical Data
Insulator Thermoplastic, UL94 V-0, black
Contact Material Copper alloy
Contact Surface Terminals (mating side): 0,2µm Au over Ni
Ground plane (mating side): 0,38µm Au over Ni
Solder side pins and ground plane: flash Au over Ni
Ground plane (mating side): 0,38µm Au over Ni
Solder side pins and ground plane: flash Au over Ni
Contact Resistance < 15 mΩ
Insulation Resistance > 5 GΩ
Test Voltage 525 V AC
Voltage Rating 175 V AC
Current Rating Terminals: 2 A
Ground Plane: 7.8 A
Ground Plane: 7.8 A
Temperature Range -55 °C ... +125 °C
Mechanical Life 100 mating cycles
Processing 260 °C for 5s max.
Downloads
Data Sheet download
Configure your product
| 060F/040P | 120F/080P | 180F/120P | |
|---|---|---|---|
| Dim A | 20.00 | 40.00 | 60.00 |
| Dim B | 16.90 | 36.90 | 56.90 |
| Dim C | 18.48 | 38.48 | 58.48 |
PCB Layouts vollbestückt - paarig bestückt / PCB Layouts fully loaded - loaded in pairs
| 060F/040P | 120F/080P | 180F/120P | |
|---|---|---|---|
| Dim A | 21.27 | 41.27 | 61.27 |
| Dim B | 20.17 | 40.17 | 60.17 |
| Dim C | 17.17 | 37.17 | 57.17 |
| Dim D | 20.13 | 40.13 | 60.13 |
PCB Layouts vollbestückt - paarig bestückt / PCB Layouts fully loaded - loaded in pairs
