Reflow Soldering Recommendation For Shorter Peak Times

Items should be soldered according to IPC/JEDEC J-STD-020C temperature profile for leadfree reflow soldering (maximum values).

Profile Feature Key Values
Minimum Temperature TSmin 150 °C
Maximum Temperatur TSmax 200 °C
Duration TSmin – TSmax 60 – 180s
Soldering Range Temperature TL 217 °C
Duration above TL 60 – 180s
Ramp-Up Rate TSmax – TP max. 3 °C / s
Peak Temperature TP 260±5 °C
Duration Peak Temperature 20 – 40s
Ramp-Down Rate TPmax – TSmin 6 °C / s
Duration 25°C - Peak Temp. TP max. 8min