Reflow Soldering Recommendation For Shorter Peak Times
Items should be soldered according to IPC/JEDEC J-STD-020C temperature profile for leadfree reflow soldering (maximum values).
| Profile Feature | Key Values |
|---|---|
| Minimum Temperature TSmin | 150 °C |
| Maximum Temperatur TSmax | 200 °C |
| Duration TSmin – TSmax | 60 – 180s |
| Soldering Range Temperature TL | Lower temperature acc. to Technical Data [°C] |
| Duration above TL | According to Technical Data [sec] |
| Ramp-Up Rate TSmax – TP | max. 3 °C / s |
| Peak Temperature TP | Upper temperature acc. to Technical Data [°C] |
| Duration Peak Temperature | According to Technical Data [sec] |
| Ramp-Down Rate TPmax – TSmin | 6 °C / s |
| Duration 25°C - Peak Temp. TP | max. 8min |
