Empfohlene Maße der Einpresszonen unserer PressFit Stift- und Buchsenleisten
Recommended Dimensions of PressFit Through Holes
| A | Bohrungs-Ø | Base Hole Ø |
|---|---|---|
| B | Ring-Ø | Ring Ø |
| C | Cu-Schicht | Cu Layer |
| D | Veredelung | Plating |
| E | Endloch-Ø | Final Hole Ø |
| F | Leiterplattendicke | PCB Thinkness |
| Serie Series | RM Pitch [mm] | A [mm] | B [mm] | C [µm] | D Option [µm] | E [mm] | F [mm] | Max. Einpresskraft Max. Press-In Force | |
|---|---|---|---|---|---|---|---|---|---|
| Sn | Au/Ni | ||||||||
| 943PF, 944PF | 2.54 | 1.15±0.03 | 1.35 min. | 25 min. | 1.5 max. Sn | 0.05~0.2 Au 2.5~5 Ni | 0.94~1.09 | 1.60 min. | 150 N per pin |
| 943PFS, 944PFS | 2.54 | 1.15±0.03 | 1.35 min. | 25 min. | 0.94~1.09 | 150 N per pin | |||
| 153PF | 2.54 | 1.15±0.03 | 1.35 min. | 25 min. | 0.94~1.09 | 89 N per pin | |||
| 182PF | 2.54 | 1.15±0.03 | 1.35 min. | 25 min. | 0.94~1.09 | 89 N per pin | |||
| 138PF | 2.54 | 1.15±0.03 | 1.35 min. | 25 min. | 1.00±0.05 | 150 N per pin | |||
| 314PF | 2.00 | 0.89±0.03 | 1.30 min. | 30 min. | 0.81±0.05 | 100 N per pin | |||
